投资者提问:请问董秘,高通AI200,250,是否有使用我司的ABF载版,或者是否有其他产品技术在AI200,250芯片上使用。董秘回答(兴森科技SZ002436):尊敬的投资者,您好!公司FCBGA封装基板是芯片封装的原材料,主要应用于CPU、GPU、FPGA、ASIC等芯片领域。芯片产品具体应用场景由客户根据自身需求确定。感谢您的关注。查看更多董秘问答>>免责声明:本信息由新浪财经从公开信息中...
Source Link投资者提问:请问董秘,高通AI200,250,是否有使用我司的ABF载版,或者是否有其他产品技术在AI200,250芯片上使用。董秘回答(兴森科技SZ002436):尊敬的投资者,您好!公司FCBGA封装基板是芯片封装的原材料,主要应用于CPU、GPU、FPGA、ASIC等芯片领域。芯片产品具体应用场景由客户根据自身需求确定。感谢您的关注。查看更多董秘问答>>免责声明:本信息由新浪财经从公开信息中...
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