大摩警告，AI半导体的强劲需求正在严重挤压封装和测试产能，迫使后端厂商拥有更强的议价能力。受三大因素影响，先进封装的价格将在2026年上涨5-10%，这是自新冠疫情芯片短缺以来的首次价格上行周期。中国台湾地区的领导厂商日月光（ASE）和京元电子（KYEC）将引领此次价格上涨。摩根士丹利表示，始于晶圆代工和存储的半导体通胀浪潮，正在向下游蔓延。芯片后端封测（OSAT）厂商正准备迎接自新冠疫情以来首个...
Source Link大摩警告，AI半导体的强劲需求正在严重挤压封装和测试产能，迫使后端厂商拥有更强的议价能力。受三大因素影响，先进封装的价格将在2026年上涨5-10%，这是自新冠疫情芯片短缺以来的首次价格上行周期。中国台湾地区的领导厂商日月光（ASE）和京元电子（KYEC）将引领此次价格上涨。摩根士丹利表示，始于晶圆代工和存储的半导体通胀浪潮，正在向下游蔓延。芯片后端封测（OSAT）厂商正准备迎接自新冠疫情以来首个...
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