IT之家 10 月 29 日消息,工商时报昨日(10 月 28 日)发布博文,报道称苹果计划在其首款折叠手机、2026 年推出的 iPhone 18 系列上,全面换用其自研的第二代 5G 基带芯片 C2,不过会继续采用台积电 4 纳米(N4)工艺量产。消息称苹果在发布 iPhone 16e 后不久,便着手研发 C2 芯片,目标是在 iPhone 18 上彻底实现基带芯片的自给自足。这也意味着 ...
Source LinkIT之家 10 月 29 日消息,工商时报昨日(10 月 28 日)发布博文,报道称苹果计划在其首款折叠手机、2026 年推出的 iPhone 18 系列上,全面换用其自研的第二代 5G 基带芯片 C2,不过会继续采用台积电 4 纳米(N4)工艺量产。消息称苹果在发布 iPhone 16e 后不久,便着手研发 C2 芯片,目标是在 iPhone 18 上彻底实现基带芯片的自给自足。这也意味着 ...
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