进博前瞻|ASML展示新款i-line光刻机 中国区总裁沈波:3D集成是芯片行业未来趋势之一

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Nov 03, 2025

10月31日,光刻机龙头厂商ASML(阿斯麦)于中国区总部上海张江办公室举办进博会展前媒体交流会。  今年是ASML第七次参加进博会,其将以“积纳米之微,成大千世界”为主题,亮相国家会展中心技术装备展区集成电路专区。此次进博会,ASML将以数字化方式展示全景光刻解决方案下的多款产品和重点业务,包括TWINSCAN NXT:870B(以下简称“NXT:870B”)和TWINSCAN XT:260(...

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