小米、OPPO联手投出一个IPO,专注先进封装测试技术,支撑AI+时代的发展浪潮

独角兽早知道
Nov 02

独角兽早知道 iponews|资讯撬动新资本|据港交所10月31日披露,江苏芯德半导体科技股份有限公司向港交所主板提交上市申请书,华泰国际为独家保荐人。综合 | 招股书 编辑 | Arti本文仅为信息交流之用,不构成任何交易建议*公众号后台回复“芯德半导体”获取完整招股书。据招股书,芯德半导体是一家半导体封测技术解决方案提供商,主要从事开发封装设计、提供定制封装产品以及封装产品测试服务。根据弗若...

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