日本半导体材料开发商大举发力,以服务将大规模量产的2nm先进芯片

爱集微
Nov 01

日本半导体材料开发商正积极扩大资本支出,以满足即将大规模生产2nm先进芯片客户的需求。据报道,东京樱工业株式会社总裁种市纪昭透露,该公司计划投资200亿日元(约1.3亿美元)在韩国平泽市建设一座光刻胶工厂,预计于2030年投产。新工厂建成后,东京樱工业在韩国的产能将增长三到四倍,主要服务三星电子和SK海力士等客户。除光刻胶工厂外,东京樱工业还计划在韩国追加投资120亿日元兴建一座高纯度化学品生产...

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