多场景覆盖中国半导体封装测试展暨中国半导体封装测试技术与市场大会兴业合金“芯”材料为封装锚定新方向10月28日至29日,中国半导体封装测试展暨中国半导体封装测试技术与市场大会(CSPT2025)在江苏淮安顺利召开。我司作为国内高端铜合金材料领域的重要企业之一,受邀在同期举办的“封装材料创新与合作大会”分论坛上发表主题报告。论坛上,我司战略发展中心研发经理陈永满以《引线框架发展趋势及高性能铜合金...
Source Link多场景覆盖中国半导体封装测试展暨中国半导体封装测试技术与市场大会兴业合金“芯”材料为封装锚定新方向10月28日至29日,中国半导体封装测试展暨中国半导体封装测试技术与市场大会(CSPT2025)在江苏淮安顺利召开。我司作为国内高端铜合金材料领域的重要企业之一,受邀在同期举办的“封装材料创新与合作大会”分论坛上发表主题报告。论坛上,我司战略发展中心研发经理陈永满以《引线框架发展趋势及高性能铜合金...
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