全球新增两座碳化硅晶圆厂,启动/加速投产

集邦化合物半导体
Nov 04, 2025

近日,全球碳化硅(SiC)功率半导体动态频频,国际大厂三菱电机位于日本熊本的8英寸SiC晶圆厂已正式竣工,预示着其试生产即将启动,同时也揭示了面对市场波动的弹性产能策略;与此同时,南亚市场亦迈出历史性一步,SiCSem在印度启动了该国首个端到端SiC制造设施的动工仪式。01三菱电机:8英寸碳化硅晶圆厂竣工,正加速投产近日,#三菱电机位于日本熊本县菊池市的8英寸SiC功率半导体制造设施已于2025年...

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