金吾财讯 | 中信建投发研报指，模型侧，AI大模型厂商的用户与收入规模处于快速扩张期，OpenAI和Anthropic的ARR仍在倍数级别增长。伴随AI应用/端侧落地加速，CSP也在加大资本开支，纷纷进行史上最大规模的基础设施投资。
硬件侧，英伟达GB300服务器方案目前进入量产期，Rubin架构方案逐步显现，ASIC玩家也在发力，算力需求高增带来GPU、存储、先进封装、PCB等子行业高增，也为国产半导体发展提供了黄金发展期。
端侧，生成式AI正在驱动新一轮内容生成、搜索和生产力相关应用的发展，覆盖包括智能手机、PC、汽车、XR以及物联网等终端品类，提供全新的用户体验，新的终端如AI眼镜、玩具、机器人正在蓄力爆发。
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