Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment

Reuters

Nov 10, 2025

Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment

Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging (PLP) and modified Semi-Additive Process (mSAP) technology. The company, a global manufacturer and solutions provider for printed circuit board $(PCB)$ and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence $(AI)$ and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory $(HBM)$ stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 10, 2025, and is solely responsible for the information contained therein.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

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The company, a global manufacturer and solutions provider for printed circuit board  and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence  and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory  stacks and Co-Packaged Optics  solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.Disclaimer: This news brief was created by Public Technologies  using generative artificial intelligence. 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