在人工智能计算需求呈指数级增长的今天,芯片散热已成为制约计算性能提升的关键瓶颈。台积电最新研发的直接硅基液冷技术(Direct-to-silicon liquid cooling)正在打破这一限制,通过在3.3倍光刻CoWoS-R封装上集成硅基微型冷却器(IMC-Si),实现了单芯片3.4千瓦的惊人散热能力,为下一代AI芯片的性能飞跃提供了热管理解决方案。这一突破性技术不仅大幅提升了散热效率,更...
Source Link在人工智能计算需求呈指数级增长的今天,芯片散热已成为制约计算性能提升的关键瓶颈。台积电最新研发的直接硅基液冷技术(Direct-to-silicon liquid cooling)正在打破这一限制,通过在3.3倍光刻CoWoS-R封装上集成硅基微型冷却器(IMC-Si),实现了单芯片3.4千瓦的惊人散热能力,为下一代AI芯片的性能飞跃提供了热管理解决方案。这一突破性技术不仅大幅提升了散热效率,更...
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