台积电突破芯片散热极限:直接硅基液冷技术实现3.4kW散热能力,为AI芯片性能飙升铺平道路

半导体行业小报
Nov 12

在人工智能计算需求呈指数级增长的今天,芯片散热已成为制约计算性能提升的关键瓶颈。台积电最新研发的直接硅基液冷技术(Direct-to-silicon liquid cooling)正在打破这一限制,通过在3.3倍光刻CoWoS-R封装上集成硅基微型冷却器(IMC-Si),实现了单芯片3.4千瓦的惊人散热能力,为下一代AI芯片的性能飞跃提供了热管理解决方案。这一突破性技术不仅大幅提升了散热效率,更...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10