国家知识产权局信息显示,宁波比亚迪半导体有限公司取得一项名为“Taiko晶圆加工装置”的专利,授权公告号CN223539581U,申请日期为2024年08月。专利摘要显示,本申请涉及一种Taiko晶圆加工装置,所述Taiko晶圆的背面粘附有划片膜,Taiko晶圆包括划片后形成的有效芯片区和围绕有效芯片区的废边区,废边区包括支撑环体,所述Taiko晶圆加工装置包括承载台和移除部,承载台用于承载粘附有...
Source Link国家知识产权局信息显示,宁波比亚迪半导体有限公司取得一项名为“Taiko晶圆加工装置”的专利,授权公告号CN223539581U,申请日期为2024年08月。专利摘要显示,本申请涉及一种Taiko晶圆加工装置,所述Taiko晶圆的背面粘附有划片膜,Taiko晶圆包括划片后形成的有效芯片区和围绕有效芯片区的废边区,废边区包括支撑环体,所述Taiko晶圆加工装置包括承载台和移除部,承载台用于承载粘附有...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.