3D Systems Unveils Next-Generation SLA Solutions at Formnext

Reuters

Nov 12

3D Systems Unveils Next-Generation SLA Solutions at Formnext

3D Systems Corporation will attend Formnext 2025, taking place from November 18-21 in Frankfurt, Germany. At the event, the company will present its new SLA 825 Dual large-frame stereolithography printer, ArrayCast solution for investment casting, and enhanced SLA materials Accura SbF and Accura Xtreme Black, designed to improve productivity and efficiency in key industries such as automotive, aerospace, and foundries.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. 3D Systems Corporation published the original content used to generate this news brief via GlobeNewswire (Ref. ID: GNW9571188-en) on November 11, 2025, and is solely responsible for the information contained therein.

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