【编者按】先进封装需要ADK就像晶圆加工需要PDK一样,但ADK需要应对2.5D/3D堆叠带来的多芯粒集成复杂度和多物理仿真等技术挑战,这就需要相关企业和行业组织协作推动先进封装的标准化。【内容目录】1. 什么是封装设计套件(ADK)?2. ADK关键组件及行业标准3. ADK解决方案主要供应商4. 结语在传统的单芯片设计中,IC设计公司与EDA工具供应商和晶圆代工厂商之间会有一个标准的PDK(...
Source Link【编者按】先进封装需要ADK就像晶圆加工需要PDK一样,但ADK需要应对2.5D/3D堆叠带来的多芯粒集成复杂度和多物理仿真等技术挑战,这就需要相关企业和行业组织协作推动先进封装的标准化。【内容目录】1. 什么是封装设计套件(ADK)?2. ADK关键组件及行业标准3. ADK解决方案主要供应商4. 结语在传统的单芯片设计中,IC设计公司与EDA工具供应商和晶圆代工厂商之间会有一个标准的PDK(...
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