11月10日消息,芯片大厂德州仪器近日宣布(Texas Instruments) 宣布,在马来西亚马六甲的第二座封装和测试工厂TIEM2 开始投入使用,预计未来每年将封装和测试数十亿颗芯片,加强其全球供应链布局。随着时间的推进,正在生产中的新工厂的潜在投资额将达到约11.98 亿美元,全面投入营运后,将为当地提供多达500 个工作职位。资料显示,德州仪器曾在2023年6月宣布,将在分别在马来西亚...
Source Link11月10日消息,芯片大厂德州仪器近日宣布(Texas Instruments) 宣布,在马来西亚马六甲的第二座封装和测试工厂TIEM2 开始投入使用,预计未来每年将封装和测试数十亿颗芯片,加强其全球供应链布局。随着时间的推进,正在生产中的新工厂的潜在投资额将达到约11.98 亿美元,全面投入营运后,将为当地提供多达500 个工作职位。资料显示,德州仪器曾在2023年6月宣布,将在分别在马来西亚...
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