IT之家 11 月 10 日消息,据外媒 Wccftech 今晚报道,英特尔研究人员找到了一种简化散热器组装的方法,使得“超大”先进封装芯片的设计更经济、散热更优。英特尔代工部门在其论文《用于先进封装的新型分解式集成散热器组装方法》中指出,工程师们提出了一种新的散热器分解式设计,这种方法不仅降低制造难度和成本,还能为高功率芯片带来更高效的散热。这套新方案专为英特尔“先进封装”技术设计,适用于多层...
Source LinkIT之家 11 月 10 日消息,据外媒 Wccftech 今晚报道,英特尔研究人员找到了一种简化散热器组装的方法,使得“超大”先进封装芯片的设计更经济、散热更优。英特尔代工部门在其论文《用于先进封装的新型分解式集成散热器组装方法》中指出,工程师们提出了一种新的散热器分解式设计,这种方法不仅降低制造难度和成本,还能为高功率芯片带来更高效的散热。这套新方案专为英特尔“先进封装”技术设计,适用于多层...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.