截至2025年11月,碳化硅市场正经历关键的价值重估与结构性分化。在价格端,低端大宗原料成本推升价格上涨,而主流6英寸衬底则因产能过剩而持续暴跌。但在应用端,SiC凭借其卓越散热性能,极有可能成为NVIDIA Rubin平台和台积电先进封装中AI芯片散热的战略性关键材料,预示SiC产业将迎来由HPC应用驱动的第二波高价值增长。1SiC价格趋势分析:基础原料上扬与高阶衬底价格战近期碳化硅(SiC)...
Source Link截至2025年11月,碳化硅市场正经历关键的价值重估与结构性分化。在价格端,低端大宗原料成本推升价格上涨,而主流6英寸衬底则因产能过剩而持续暴跌。但在应用端,SiC凭借其卓越散热性能,极有可能成为NVIDIA Rubin平台和台积电先进封装中AI芯片散热的战略性关键材料,预示SiC产业将迎来由HPC应用驱动的第二波高价值增长。1SiC价格趋势分析:基础原料上扬与高阶衬底价格战近期碳化硅(SiC)...
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