来源:格隆汇新股小米、深创投押注,江苏南京半导体封测巨头冲击IPO,年入8亿元发哥说新股近一个月,半导体产业链在资本市场全面开花。例如,芯片设计领域的富瀚微、聚芯微电子、中微半导,晶圆领域的上海超硅,存储芯片领域的晶存科技、佰维存储,半导体设备领域的珠海宝丰堂等,相继迎来IPO进展。作为半导体产业链下游的环节,封测领域也有不少公司在寻求上市,包括越亚半导体、盛合晶微、芯徳半导体等。格隆汇获悉,江苏...
Source Link来源:格隆汇新股小米、深创投押注,江苏南京半导体封测巨头冲击IPO,年入8亿元发哥说新股近一个月,半导体产业链在资本市场全面开花。例如,芯片设计领域的富瀚微、聚芯微电子、中微半导,晶圆领域的上海超硅,存储芯片领域的晶存科技、佰维存储,半导体设备领域的珠海宝丰堂等,相继迎来IPO进展。作为半导体产业链下游的环节,封测领域也有不少公司在寻求上市,包括越亚半导体、盛合晶微、芯徳半导体等。格隆汇获悉,江苏...
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