当我们为芯片制程的每一个纳米进步而欢呼时，一个常被忽视的维度正悄然成为性能提升的主战场：互连。先进封装的本质，是一场旨在解决芯片内部及芯片之间“数据交通拥堵”的深刻革命。它不再仅仅关乎晶体管的数量，而是关乎如何让这些晶体管之间，以及芯片与芯片之间，实现前所未有的高效对话。一、 问题的核心：传统互连已成为性能的“枷锁”在传统芯片中，数据流动面临两大瓶颈：片内互连瓶颈：在单片系统芯片上，计算核心、缓存...
Source Link当我们为芯片制程的每一个纳米进步而欢呼时，一个常被忽视的维度正悄然成为性能提升的主战场：互连。先进封装的本质，是一场旨在解决芯片内部及芯片之间“数据交通拥堵”的深刻革命。它不再仅仅关乎晶体管的数量，而是关乎如何让这些晶体管之间，以及芯片与芯片之间，实现前所未有的高效对话。一、 问题的核心：传统互连已成为性能的“枷锁”在传统芯片中，数据流动面临两大瓶颈：片内互连瓶颈：在单片系统芯片上，计算核心、缓存...
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