智通财经APP获悉，据花旗对高通(QCOM.US)招聘信息的分析，高通可能正在评估英特尔(INTC.US)来代工其数据中心专用集成电路业务(ASIC)。这些招聘启事都在寻找具备英特尔嵌入式多芯片互连桥封装技术资质的候选人。花旗还指出，苹果(AAPL.US)和博通(AVGO.US)也有类似的招聘启事。花旗分析师表示，这些公司可能试图通过利用英特尔代工服务来符合美国《芯片与科学法案》的要求，该法案旨在增加美国国内半导体制造。
花旗分析师Christopher Danely周三在给投资者的一份报告中称：“我们注意到，如果这三项潜在合作达成，都将涉及封装业务，该业务定价和利润率较低，而非前端代工业务。鉴于英特尔在该领域远远落后于台积电(TSM.US)，我们也不认为这些努力会对英特尔产生实质性影响。”
此外，Danely补充道，数据中心专用集成电路在英特尔的销售额中占比不到 1%，这意味着即便这些交易真的达成，也不会“成为英特尔代工业务的重要收入来源”。花旗维持对高通“中性”评级，并维持对英特尔“卖出”评级。
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