本文由半导体产业纵横(ID:ICVIEWS)综合台积电正在悄然加快芯片封装基板(CoPoS)的量产步伐。目前,市场关注的焦点在于英伟达AI GPU和各种ASIC芯片日益增长的需求,随着台积电计划扩大其CoWoS产能,以及OSAT合作伙伴加入竞争,市场乐观情绪日益高涨。与此同时,台积电正在悄然加快芯片封装基板(CoPoS)的量产步伐。在 2025 年第三季度确定设备供应商、机器规格和初始订单量后,...
Source Link本文由半导体产业纵横(ID:ICVIEWS)综合台积电正在悄然加快芯片封装基板(CoPoS)的量产步伐。目前,市场关注的焦点在于英伟达AI GPU和各种ASIC芯片日益增长的需求,随着台积电计划扩大其CoWoS产能,以及OSAT合作伙伴加入竞争,市场乐观情绪日益高涨。与此同时,台积电正在悄然加快芯片封装基板(CoPoS)的量产步伐。在 2025 年第三季度确定设备供应商、机器规格和初始订单量后,...
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