在全球半导体产业竞争白热化的今天,一场围绕先进封装技术的暗战正在悄然上演。当台积电在晶圆代工领域占据绝对主导地位时,英特尔凭借其独特的先进封装技术正迎来意想不到的逆袭机会。最新迹象显示,苹果和高通两大科技巨头正在积极布局英特尔的EMIB(嵌入式多芯片互连桥)先进封装技术,这可能会重塑整个半导体供应链的竞争格局。先进封装:后摩尔时代的技术突围随着人工智能、高性能计算和5G应用的爆发式增长,传统芯片...
Source Link在全球半导体产业竞争白热化的今天,一场围绕先进封装技术的暗战正在悄然上演。当台积电在晶圆代工领域占据绝对主导地位时,英特尔凭借其独特的先进封装技术正迎来意想不到的逆袭机会。最新迹象显示,苹果和高通两大科技巨头正在积极布局英特尔的EMIB(嵌入式多芯片互连桥)先进封装技术,这可能会重塑整个半导体供应链的竞争格局。先进封装:后摩尔时代的技术突围随着人工智能、高性能计算和5G应用的爆发式增长,传统芯片...
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