大芯片封装,三分天下

半导体行业观察
Nov 20

公众号记得加星标⭐️,第一时间看推送不会错过。在AI芯片快速发展的浪潮中,GPU、AI ASIC等高性能计算(HPC)核心,以及HBM(高带宽内存),正成为采用 2.5D/3D 封装技术的高端产品的主力军。先进封装平台对于提升器件的性能和带宽至关重要,其重要性已使其成为半导体领域最热门的话题,热度甚至超越了以往的尖端工艺节点。近期,有关英特尔的先进封装技术 EMIB 正被科技巨头苹果和高通评估的...

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