【产业信息速递】三大巨头:HBM产能全售罄

北京半导体行业...
Nov 19

(信息来源:半导体行业观察综合)三星电子在第三季度开始向英伟达公司交付期待已久的HBM3E芯片后,其下一代HBM4芯片明年的产量已全部售罄,这凸显了全球内存市场在人工智能服务器需求激增的推动下强劲复苏。这家韩国内存巨头周四表示,其HBM3E芯片“目前正在量产并已售予所有相关客户”,证实其第五代高带宽内存已成功交付给英伟达。韩国《经济日报》9月份曾报道,三星已通过英伟达对其12层HBM3E产品的认证...

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