台积电产能满载之下,先进封装战场已暗流涌动

电子半导体观察
Nov 18

点击上方“蓝色”关注更多精彩在先进封装领域,台积电虽长期占据主导地位,但英特尔的技术正迎头赶上。其EMIB与Foveros封装方案日益受到业界重视。从苹果、高通近期发布的招聘信息中可见,多家企业正积极招募具备EMIB封装经验的工程师。尽管招聘需求不能等同于技术采纳的明确信号,但仍透露出芯片行业对英特尔先进封装能力的兴趣正在逐步升温。这一趋势背后,是台积电先进封装产能趋紧的现状——英伟达、AMD等...

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