IT之家 11 月 22 日消息，博主 @数码闲聊站 今天在微博透露，多家手机厂商正在测试内置风扇新机。
博主表示，这些手机的处理器很多样，具体有高通骁龙 8 Gen 5、联发科天玑 9500（+）、骁龙 8 Elite Gen 5 等，全部支持“满级防水”，理论上具备防尘能力，大概率明年上半年都能见到。
后续有用户在评论区表示：“不喜欢！！好端端的又多一个占用空间的零件。。。搞毛啊？”，博主回复道：“风扇可能是接下来的行业方向，明年进入 2nm 制程后，芯片工艺很难再有大突破，要想办法整活儿”；另一名用户则询问道：“iQOO15ultra 有消息吗”，博主回复道：“差不多了，等定档”。
结合IT之家此前报道，realme 真我曾在今年 8 月亮相了一台内置“空调”的性能旗舰，搭载 7700mm² 超大单体 VC，配备 TEC 制冷元件、全新固态制冷方式，开启风扇时温度可降 6°C。
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