开放创“芯”,成就未来:中芯国际参展2025成都ICCAD

中芯国际
Nov 26

11月20日至21日,2025集成电路发展论坛(成渝)暨第三十一届集成电路设计业展览会(ICCAD-Expo 2025)在四川成都中国西部国际博览城隆重举行,大会吸引来自全球各地300余家半导体产业链顶尖厂商参展。作为中国大陆集成电路制造业的领军者,中芯国际深度参与了此次盛会,携手产业链伙伴共同推动“开放创芯,成就未来”产业发展新图景。在会场,与会者围绕行业前沿技术、应用场景、产业政策与宏观趋势...

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