前言:AI大模型、HPC、5G通信等场景对芯片算力、带宽和能效的需求呈指数级增长,半导体行业正迎来一场深刻的产业变革。先进封装技术从芯片的[保护壳]摇身一变,成为决定系统级性能的核心竞争力,一场围绕千亿美金市场的[芯]战争已然打响。作者| 方文三图片来源|网 络先进封装千亿市场的增长逻辑据Yole Group数据,2024年全球先进封装市场规模约为450亿美元,预计将以9.4%的复合年增长率强劲...
Source Link前言:AI大模型、HPC、5G通信等场景对芯片算力、带宽和能效的需求呈指数级增长,半导体行业正迎来一场深刻的产业变革。先进封装技术从芯片的[保护壳]摇身一变,成为决定系统级性能的核心竞争力,一场围绕千亿美金市场的[芯]战争已然打响。作者| 方文三图片来源|网 络先进封装千亿市场的增长逻辑据Yole Group数据,2024年全球先进封装市场规模约为450亿美元,预计将以9.4%的复合年增长率强劲...
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