格隆汇11月25日丨晶升股份在业绩说明会上表示,硅半导体行业目前已逐步完成去库存;华虹、中芯、长存、长鑫等下游芯片厂正在积极布局新产能,随着建设周期的完成,对于材料的需求将逐渐释放。光伏行业正处于反内卷调整时期,碳化硅行业下游新应用不断产生,12英寸碳化硅技术的突破也将会逐步带动需求量的提升。
Source Link格隆汇11月25日丨晶升股份在业绩说明会上表示,硅半导体行业目前已逐步完成去库存;华虹、中芯、长存、长鑫等下游芯片厂正在积极布局新产能,随着建设周期的完成,对于材料的需求将逐渐释放。光伏行业正处于反内卷调整时期,碳化硅行业下游新应用不断产生,12英寸碳化硅技术的突破也将会逐步带动需求量的提升。
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