当晶体管微缩逼近物理极限，先进封装便成为决定芯片性能的“第二核心阵地”。而EMIB的出现，恰逢其时。012026年CoWoS产能，被谁瓜分？CoWoS（Chip-on-Wafer-on-Substrate），是AI 时代名副其实的“香饽饽”。作为台积电在“超越摩尔定律” 道路上的核心技术，Chip-on-Wafer（CoW）工艺将多个芯片（如GPU、CPU和HBM等）堆叠并键合到硅中介晶圆上；然后...
Source Link当晶体管微缩逼近物理极限，先进封装便成为决定芯片性能的“第二核心阵地”。而EMIB的出现，恰逢其时。012026年CoWoS产能，被谁瓜分？CoWoS（Chip-on-Wafer-on-Substrate），是AI 时代名副其实的“香饽饽”。作为台积电在“超越摩尔定律” 道路上的核心技术，Chip-on-Wafer（CoW）工艺将多个芯片（如GPU、CPU和HBM等）堆叠并键合到硅中介晶圆上；然后...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.