汇集半导体行业资讯 技术前沿、发展趋势!近期,美国存储芯片巨头美光科技宣布,计划在日本广岛投资96亿美元建设高带宽内存(HBM)晶圆厂。该项目预计2024年5月开工,2028年左右实现出货,建成后将进一步强化美光在AI芯片关键存储领域的产能布局,同时借助日本政府补贴降低投资成本。日本政府提供高额补贴 项目落地获政策支撑据日本经济产业省披露,针对美光此次HBM晶圆厂项目,政府预计将提供高达5000...
Source Link汇集半导体行业资讯 技术前沿、发展趋势!近期,美国存储芯片巨头美光科技宣布,计划在日本广岛投资96亿美元建设高带宽内存(HBM)晶圆厂。该项目预计2024年5月开工,2028年左右实现出货,建成后将进一步强化美光在AI芯片关键存储领域的产能布局,同时借助日本政府补贴降低投资成本。日本政府提供高额补贴 项目落地获政策支撑据日本经济产业省披露,针对美光此次HBM晶圆厂项目,政府预计将提供高达5000...
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