中国粉体网讯近期,晶盛机电董事长曹建伟在一次演讲中提到,碳化硅衬底除了新能源汽车这一核心赛道之外,还涌现出两大新兴应用方向:一是先进封装领域,碳化硅因优异的散热性能,台积电正在推进碳化硅衬底在CoWoS封装中的应用,以解决AI芯片高功耗和散热问题;二是光学领域,以META为代表的企业在光学镜片中引入碳化硅材料,进一步拓展了碳化硅的应用边界。这些新赛道的崛起,改变了行业对碳化硅衬底尺寸的预期。原本...
Source Link中国粉体网讯近期,晶盛机电董事长曹建伟在一次演讲中提到,碳化硅衬底除了新能源汽车这一核心赛道之外,还涌现出两大新兴应用方向:一是先进封装领域,碳化硅因优异的散热性能,台积电正在推进碳化硅衬底在CoWoS封装中的应用,以解决AI芯片高功耗和散热问题;二是光学领域,以META为代表的企业在光学镜片中引入碳化硅材料,进一步拓展了碳化硅的应用边界。这些新赛道的崛起,改变了行业对碳化硅衬底尺寸的预期。原本...
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