电子发烧友网综合报道 最近，英特尔EMIB封装火了，在苹果、高通、博通的招聘信息中，都指出正在招募熟悉EMIB封装的工程师。近期还有消息称，由于台积电CoWoS 先进封装产能持续紧张，Marvell和联发科也正在考虑将英特尔EMIB封装应用到ASIC芯片中。EMIB（Embedded Multi-die Interconnect Bridge，嵌入式多芯片互连桥）是英特尔主导推广的一种2.5D ...
Source Link电子发烧友网综合报道 最近，英特尔EMIB封装火了，在苹果、高通、博通的招聘信息中，都指出正在招募熟悉EMIB封装的工程师。近期还有消息称，由于台积电CoWoS 先进封装产能持续紧张，Marvell和联发科也正在考虑将英特尔EMIB封装应用到ASIC芯片中。EMIB（Embedded Multi-die Interconnect Bridge，嵌入式多芯片互连桥）是英特尔主导推广的一种2.5D ...
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