散热被认为是AI时代非常重要的一环,当前投资圈普遍认可液冷是散热的主流方式。然而瑞银近期发布一篇深度研究报告,从散热材料出发,抛出了一个全新的方向——高纯度氧化铝HPA。瑞银在报告中写道:“为突破下一代AI硬件的散热效率瓶颈,行业正将目光投向新型封装材料,高纯度氧化铝(HPA)因其兼具高导热性、电绝缘性与机械兼容性的独特属性,关注度持续走高。”与高性能氮化物,如氮化铝AIN、氮化硼BN相比,HPA...
Source Link散热被认为是AI时代非常重要的一环,当前投资圈普遍认可液冷是散热的主流方式。然而瑞银近期发布一篇深度研究报告,从散热材料出发,抛出了一个全新的方向——高纯度氧化铝HPA。瑞银在报告中写道:“为突破下一代AI硬件的散热效率瓶颈,行业正将目光投向新型封装材料,高纯度氧化铝(HPA)因其兼具高导热性、电绝缘性与机械兼容性的独特属性,关注度持续走高。”与高性能氮化物,如氮化铝AIN、氮化硼BN相比,HPA...
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