格隆汇12月10日|据台湾电子时报,半导体设备厂商透露,台积电与日月光集团、Amkor与联电等都在加速扩充先进封装CoWoS产能,从订单分布观察,2026~2027年GPU、ASIC客户需求均超出预期。其中,英伟达持续预订台积CoWoS过半产能,博通与AMD分别占据二、三名。
Source Link格隆汇12月10日|据台湾电子时报,半导体设备厂商透露,台积电与日月光集团、Amkor与联电等都在加速扩充先进封装CoWoS产能,从订单分布观察,2026~2027年GPU、ASIC客户需求均超出预期。其中,英伟达持续预订台积CoWoS过半产能,博通与AMD分别占据二、三名。
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