硅光子技术竞争升温,三星发力缩小与台积电差距

半导体产业研究
Dec 09

图片来源:DIGITIMES三星电子正加速硅光子(SiPh)技术的研发进程,旨在解决先进AI处理器的技术瓶颈,同时缩小与台积电的竞争差距。该公司正在拓展全球研发网络,并计划于2027年实现共封装光学技术的商业化。行业消息称,这一时间节点将开启其与中国台湾地区同行在下一代封装领域的直接竞争。十年前,硅光子技术还多停留在理论层面,因为将电信号嵌入激光生成的光束、通过微型波导传输光束、再在接收端将其转换...

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