Arm未来5年将在韩国培养1400名半导体IP设计专业人才

IT之家
Dec 09, 2025

作为软银董事长孙正义、Arm CEO 雷内・哈斯 (Rena Hass) 韩国访问成果的一部分,Arm 当地时间本月 5 日与韩国产业通商资源部签署了《强化韩国半导体与 AI 产业》谅解备忘录 (MoU)。

根据这份备忘录,Arm 将同产业通商资源部一道在明年设立“Arm 学校”,目标在未来五年内培养 1400 名半导体 IP 设计专业人才,以补足韩国在 Fabless、晶圆代工等系统半导体领域的竞争力短板。

Arm 还将和韩国产业通商资源部强化技术交流与生态系统、产学联动、共同研发。双方计划为落实备忘录成立工作组,并协商具体成果产出方案。

美股频道更多独家策划、专家专栏,免费查阅>>

责任编辑:栎树

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10