HBM4 TC键合机,SK海力士又下订

半导体产业纵横
Dec 11

本文由半导体产业纵横(ID:ICVIEWS)综合鹬蚌相争,渔翁得利。韩国芯片制造商 SK 海力士已向新加坡 ASMPT 订购了一批用于生产 HBM4(最新高带宽存储器 (HBM))的热压 (TC) 键合机。这项新订单出台之际,SK 海力士在韩国的其他 TC 键合机供应商韩美半导体和韩华半导体之间正就专利问题展开激烈争论。这家韩国芯片制造商上个月向ASMPT订购了7套TC键合机,每套包含两个键合头。...

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