全球AI芯片需求爆发式增长正引发一场前所未有的先进封装产能争夺战。台积电CoWoS先进封装产能已成为比晶圆代工更为稀缺的战略资源,NVIDIA、博通、AMD等芯片巨头纷纷提前锁定2026-2027年产能。最新数据显示,台积电将2026年CoWoS月产能目标上调至12.7万片,较原计划提升逾50%,而非台积电阵营的日月光、Amkor和联电等也将产能规划从2.6万片提升至4万片。这场产能竞赛不仅反映了...
Source Link全球AI芯片需求爆发式增长正引发一场前所未有的先进封装产能争夺战。台积电CoWoS先进封装产能已成为比晶圆代工更为稀缺的战略资源,NVIDIA、博通、AMD等芯片巨头纷纷提前锁定2026-2027年产能。最新数据显示,台积电将2026年CoWoS月产能目标上调至12.7万片,较原计划提升逾50%,而非台积电阵营的日月光、Amkor和联电等也将产能规划从2.6万片提升至4万片。这场产能竞赛不仅反映了...
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