IT之家 12 月 9 日消息,科技媒体 Wccftech 昨日(12 月 8 日)发布博文,报道称台积电(TSMC)目前面临 CoWoS 先进封装产能严重饱和的困境,已无法单独满足英伟达、苹果等客户对 AI 芯片的爆发式需求。为解决这一瓶颈,台积电决定改变策略,将部分“溢出”订单外包给日月光投控(ASE)和硅品精密(SPIL)等封测大厂。IT之家援引博文介绍,随着人工智能浪潮席卷全球,通过组合...
Source LinkIT之家 12 月 9 日消息,科技媒体 Wccftech 昨日(12 月 8 日)发布博文,报道称台积电(TSMC)目前面临 CoWoS 先进封装产能严重饱和的困境,已无法单独满足英伟达、苹果等客户对 AI 芯片的爆发式需求。为解决这一瓶颈,台积电决定改变策略,将部分“溢出”订单外包给日月光投控(ASE)和硅品精密(SPIL)等封测大厂。IT之家援引博文介绍,随着人工智能浪潮席卷全球,通过组合...
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