在消费性电子与AI新品驱动下,2025年第三季度前十大晶圆代工产值季增8.1%

与非网
Dec 15

2025年第三季全球晶圆代工产业持续受AI高效能运算(HPC),和消费性电子新品主芯片与周边IC需求带动,以7nm(含)以下先进制程生产的高价晶圆贡献营收最为显著,加上部分厂商得益于供应链分化商机,推升前十大晶圆代工厂第三季合计营收季增8.1%,接近451亿美元。TrendForce集邦咨询表示,由于预期2026年景气与需求将受国际形势影响,同时2025年中以来存储器逐季涨价、产能吃紧,供应链对...

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