英特尔晶圆代工,初露曙光

半导体行业观察
Dec 19, 2025

据报道,NVIDIA 和 AMD 正在评估英特尔晶圆代工的 14A 制程节点,而苹果和博通则在考虑采用英特尔的 EMIB 封装技术来开发定制服务器加速器。香港广发证券指出,这些进展反映出顶级设计公司越来越愿意重新考虑其前端工艺技术和后端封装的供应商。台积电等其他供应商的产能限制可能是促使这些探索性举措的关键因素,封装的可用性如今已成为大型设计公司面临的核心制约因素。就苹果而言,供应链报告显示,该...

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