台积电美国二厂2026年夏季设备进场,2027年实现3nm量产

爱集微
Dec 18, 2025

台积电(TSMC)计划于2026年夏季启动其位于美国亚利桑那州第二座芯片工厂的设备安装工作,目标在2027年实现3nm制程量产。这些设备的安装将标志着这家全球最大的芯片代工制造商在海外先进芯片制造领域迈出了重要一步。多名消息人士透露,设备进场预计集中在明年7月至9月期间完成。目前的进度安排符合台积电董事长兼首席执行官魏哲家推动将美国芯片生产至少提前“几个季度”的计划。其美国第二座工厂此前计划于...

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