【券商聚焦】中信证券:预计2025年/2026年全球半导体晶圆制造设备市场规模将维持高个位数百分比同比增长

金吾财讯
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金吾财讯 | 中信证券研报指,2025年9月以来,受下游大客户英特尔一系列注资合作、存储原厂陆续涨价等事件催化,头部半导体设备公司股价快速上行。

该机构表示,考虑到本轮存储上行周期以及下游积极的逻辑需求,预计2025年/2026年全球半导体晶圆制造设备(WFE)市场规模将维持高个位数百分比同比增长,且存储占比有望进一步提升。同时,预计2026年中国大陆市场需求的正常化也将使得此前管制不确定性等风险逐步降低。该机构看好半导体设备行业的投资机遇。

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