12月20日,由半导体投资联盟和集成电路投资创新联盟主办、ICT知识产权发展联盟协办、爱集微承办的“2026半导体投资年会暨IC风云榜颁奖典礼”在上海隆重举行。本届年会以“AI赋能・共筑未来——技术创新与产业融合之路”为主题,聚焦人工智能与大模型在半导体产业中的深度融合与落地实践。会上,集微咨询资深分析师张浩发布了《2025中美半导体上市公司数据分析》报告。张浩表示,由于2023年下半年IPO...
Source Link12月20日,由半导体投资联盟和集成电路投资创新联盟主办、ICT知识产权发展联盟协办、爱集微承办的“2026半导体投资年会暨IC风云榜颁奖典礼”在上海隆重举行。本届年会以“AI赋能・共筑未来——技术创新与产业融合之路”为主题,聚焦人工智能与大模型在半导体产业中的深度融合与落地实践。会上,集微咨询资深分析师张浩发布了《2025中美半导体上市公司数据分析》报告。张浩表示,由于2023年下半年IPO...
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