据《日经亚洲》引述消息称,台积电计划于2026年夏季开始,将制程设备运往美国亚利桑那州的第二座工厂,为2027年启动3纳米制程量产铺路;明年第三季起,相关设备将开始进驻工厂。报道指,有关时间表符合集团总裁魏哲家希望提前数季量产3纳米芯片的预期。该座厂房原先规划要到2028年才投产。有业界人士表示,晶圆厂的设备安装后,生产线需时一年才能完成认证,并逐步提升产能。越先进的晶圆制程所需时间越久,因生产步骤已增至逾1000道,且需投入大量工作以转移并验证制程至另一厂房。
据《日经亚洲》引述消息称,台积电计划于2026年夏季开始,将制程设备运往美国亚利桑那州的第二座工厂,为2027年启动3纳米制程量产铺路;明年第三季起,相关设备将开始进驻工厂。报道指,有关时间表符合集团总裁魏哲家希望提前数季量产3纳米芯片的预期。该座厂房原先规划要到2028年才投产。有业界人士表示,晶圆厂的设备安装后,生产线需时一年才能完成认证,并逐步提升产能。越先进的晶圆制程所需时间越久,因生产步骤已增至逾1000道,且需投入大量工作以转移并验证制程至另一厂房。
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