英伟达和AMD正在评估英特尔14A工艺

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最近传出不少公司开始对英特尔的EMIB先进封装技术产生兴趣,包括美满电子科技(Marvell)、谷歌、Meta和联发科等行业巨头,或许会打造“前端投片台积电,后端封装英特尔”的新模式。通过英特尔替换掉台积电的CoWoS封装,毕竟后者的封装产能远远不能满足市场需求。另外通过公开的招聘信息,显示苹果和高通都在寻找具备英特尔EMIB先进封装技术专业知识的人员。据TECHPOWERUP报道,苹果已经在对...

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