大日本印刷（DNP）开发出了能以十分之一的耗电量生产先进半导体的技术。将面向佳能生产的新方式制造装置，于2027年量产可支持新一代1.4纳米（1纳米为十亿分之一米）产品的核心构件。人工智能（AI）半导体的制造成本有大幅降低的可能性。
目前，要量产最先进的半导体，需要使用全球只有荷兰阿斯麦控股（ASML Holdings）生产的极紫外（EUV）光刻机。在晶圆（基板）上绘制电路的“光刻工序”占半导体总制造成本的3至5成。电路越精细，光刻次数就越多，耗电量也随之增加。一台EUV光刻机的价格为300亿日元左右，给半导体厂商带来沉重的投资负担。
而佳能的“纳米压印（Nanoimprint ）”制造装置采用类似盖印章的方式在晶圆上制作电路。DNP开发出了相当于精细印章的电路原版“模板（template）” ，最高可用于1.4纳米制程。此前该技术无法支持2纳米等先进半导体的制造。
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