ASMPT(00522.HK)取得芯片到基底TCB设备新订单

阿斯达克财经
Dec 22

ASMPT(00522.HK) 宣布,近日从一家领先晶圆代工厂的主要外判半导体装嵌测试(OSAT)合作伙伴手上取得新订单,涉及15台应用于芯片到基底的热压焊接(TCB)设备,预料将用于尖端AI计算芯片生产。ASMPT首席执行官黄梓达表示,取得相关订单印证了客户对公司作为首选技术和生产合作伙伴的信赖,预期可巩固ASMPT作为先进封装发展关键推动者的地位。(gc/w)(港股报价延迟最少十五分钟。沽空...

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