总投资10亿元,富乐华高导热陶瓷基板项目主体封顶

SEMI
Dec 26, 2025

据东台融媒、富乐华半导体官方消息,12月23日,江苏富乐华半导体科技股份有限公司在盐城东台高新区投资建设的高导热大功率溅射陶瓷基板项目主体结构正式封顶。据悉,该项目规划总投资10亿元,一期项目引进国内外先进的磁控溅射机、自动敷胶机、光刻机、全自动显影机、电镀铜线、电镀镍金线、自动抛光机、自动光学检测设备、超声扫描设备等约200台/套,全部建成投产后,年可新增高导热大功率溅射陶瓷基板180万片,不仅...

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